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Solder joint reliability prediction for multiple environments /

Bibliographic Details
Main Author: Perkins, Andrew Eugene
Other Authors: Sitaraman, Suresh
Format: eBook
Language:English
Published: New York ; London : Springer, 2008.
Subjects:
Electronic apparatus and appliances > Reliability.
Joints (Engineering) > Reliability.
Solder and soldering.
Engineering.
Engineering: Electrical.
TECHNOLOGY & ENGINEERING > Electronics > Digital.
TECHNOLOGY & ENGINEERING > Electronics > Microelectronics.
Electronic books.
Online Access:Connect to the full text of this electronic book
Description
Item Description:Electronic resource.
Physical Description:1 online resource.
ISBN:0387793941 (electronic bk.)
9780387793948 (electronic bk.)
DOI:10.1007/978-0-387-79394-8