Solder joint reliability prediction for multiple environments /

Bibliographic Details
Main Author:	Perkins, Andrew Eugene
Other Authors:	Sitaraman, Suresh
Format:	eBook
Language:	English
Published:	New York ; London : Springer, 2008.
Subjects:	Electronic apparatus and appliances > Reliability. Joints (Engineering) > Reliability. Solder and soldering. Engineering. Engineering: Electrical. TECHNOLOGY & ENGINEERING > Electronics > Digital. TECHNOLOGY & ENGINEERING > Electronics > Microelectronics. Electronic books.
Online Access:	Connect to the full text of this electronic book

Available Online