Ultra-thin chip technology and applications /

Bibliographic Details
Corporate Author:	SpringerLink (Online service)
Other Authors:	Burghartz, Joachim N.
Format:	eBook
Language:	English
Published:	New York : Springer, [2011]
Subjects:	Integrated circuits > Wafer-scale integration > Design and construction. Integrated circuits > Wafer-scale integration. Electronic books.
Online Access:	Connect to the full text of this electronic book

Available Online