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Thermal management of power semiconductor packages--matching cooling technologies with packaging technologies : IMAPS 2nd Advanced Technoilogy Workshop on Automotive Microelectronics and Packaging, Dearborn, MI, April 27, 2010 /

Bibliographic Details
Main Author: Bennion, Kevin
Corporate Author: National Renewable Energy Laboratory (U.S.)
Other Authors: Moreno, Gilbert
Format: Government Document Book
Language:English
Published: Golden, Colo. : National Renewable Energy Laboratory, [2009]
Series:NREL/PR ; 540-48147.
Subjects:
Power semiconductors > Cooling.
Power semiconductors > Packaging.
Online Access:https://purl.fdlp.gov/GPO/LPS124496

Internet

https://purl.fdlp.gov/GPO/LPS124496

Available Online

Holdings details from Available Online
Call Number: E 9.22:NREL/PR-540-48147
 
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E 9.22:NREL/PR-540-48147 Available