SpringerLink (Online service), Fan, X. J., & Suhir, E. (2010). Moisture sensitivity of plastic packages of IC devices. Springer. https://doi.org/10.1007/978-1-4419-5719-1
Chicago Style (17th ed.) CitationSpringerLink (Online service), X. J. Fan, and Ephraim Suhir. Moisture Sensitivity of Plastic Packages of IC Devices. New York: Springer, 2010. https://doi.org/10.1007/978-1-4419-5719-1.
MLA (9th ed.) CitationSpringerLink (Online service), et al. Moisture Sensitivity of Plastic Packages of IC Devices. Springer, 2010. https://doi.org/10.1007/978-1-4419-5719-1.
Warning: These citations may not always be 100% accurate.