Moisture sensitivity of plastic packages of IC devices /

Bibliographic Details
Corporate Author:	SpringerLink (Online service)
Other Authors:	Fan, X. J., Suhir, Ephraim
Format:	eBook
Language:	English
Published:	New York : Springer, [2010]
Series:	Micro- and opto-electronic materials, structures, and systems.
Subjects:	Electronic packaging > Moisture. Plastics in packaging > Moisture. Electronic books.
Online Access:	Connect to the full text of this electronic book

Available Online