Electrical conductive adhesives with nanotechnologies /

Bibliographic Details
Main Author:	Wong, C.
Corporate Author:	SpringerLink (Online service)
Other Authors:	Lu, D., Y, Li
Format:	eBook
Language:	English
Published:	New York ; London : Springer, 2009.
Subjects:	Adhesives > Electric properties. Electronic packaging. Nanostructured materials. Solder and soldering. Engineering. Engineering: Electrical. Electronic books.
Online Access:	Connect to the full text of this electronic book

Available Online