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Induction curing of a phase-toughened adhesive /

Phase-toughened epoxy/dicyandiamide adhesives were loaded with magnetic particle filler and then cured by induction processing. The effect of induction field magnitude and exposure time on bonding strength of the loaded adhesives was characterized. At low magnetic field amplitudes, bond strength inc...

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Bibliographic Details
Main Author: Yungwirth, Christian J.
Corporate Author: U.S. Army Research Laboratory
Other Authors: Wetzel, Eric D., Sands, James M.
Format: Government Document eBook
Language:English
Published: Aberdeen Proving Ground, Md. : Army Research Laboratory, [2003]
Series:ARL-TR (Aberdeen Proving Ground, Md.) ; 2999.
Subjects:
Adhesives.
Epoxy compounds.
Adhesives, seals and binders.
Magnetic properties.
Bonding.
Magnetic fields.
Exposure(general)
Strength(mechanics)
Particles.
Bonded joints.
Curing.
Amplitude.
Thermal degradation.
Induction systems.
Fillers.
DICYANDIAMIDE
Online Access:https://purl.fdlp.gov/GPO/gpo1392
Description
Summary:Phase-toughened epoxy/dicyandiamide adhesives were loaded with magnetic particle filler and then cured by induction processing. The effect of induction field magnitude and exposure time on bonding strength of the loaded adhesives was characterized. At low magnetic field amplitudes, bond strength increased significantly with exposure time, with the highest strength bonds occurring after 60-min exposures. At high magnetic field amplitudes, bond strength increased only slightly with exposure time, so that significant bond strength was reached after 15 min of exposure. In general, the induction-cured adhesives exhibited lower bond strengths than comparable oven-cured adhesives. All of these strength trends were likely due to process- induced variations in the adhesive degree of cure, toughening phase development, or thermal degradation.
Item Description:Title from title screen (viewed Nov. 26, 2010).
"June 2003."
Electronic resource.
Physical Description:1 online resource (1 volume (various pagings)) : digital, PDF file.
Bibliography:Includes bibliographical references (pages 20-21).
Access:APPROVED FOR PUBLIC RELEASE.