Induction curing of a phase-toughened adhesive /

Phase-toughened epoxy/dicyandiamide adhesives were loaded with magnetic particle filler and then cured by induction processing. The effect of induction field magnitude and exposure time on bonding strength of the loaded adhesives was characterized. At low magnetic field amplitudes, bond strength inc...

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Bibliographic Details
Main Author:	Yungwirth, Christian J.
Corporate Author:	U.S. Army Research Laboratory
Other Authors:	Wetzel, Eric D., Sands, James M.
Format:	Government Document eBook
Language:	English
Published:	Aberdeen Proving Ground, Md. : Army Research Laboratory, [2003]
Series:	ARL-TR (Aberdeen Proving Ground, Md.) ; 2999.
Subjects:	Adhesives. Epoxy compounds. Adhesives, seals and binders. Magnetic properties. Bonding. Magnetic fields. Exposure(general) Strength(mechanics) Particles. Bonded joints. Curing. Amplitude. Thermal degradation. Induction systems. Fillers. DICYANDIAMIDE
Online Access:	https://purl.fdlp.gov/GPO/gpo1392

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https://purl.fdlp.gov/GPO/gpo1392

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Call Number	Status	Get It
Call Number:		D 101.133:2999

D 101.133:2999	Available