Advanced Materials for Thermal Management of Electronic Packaging /

Bibliographic Details

Main Author:	Tong, Xingcun Colin
Corporate Author:	SpringerLink (Online service)
Format:	eBook
Language:	English
Published:	New York, NY : Springer Springer Science+Business Media, LLC, 2011.
Edition:	1.
Series:	Springer series in advanced microelectronics ; 30.
Subjects:	Electronics. Engineering. Optical materials. Physics. Electrical engineering. Electronic books.
Online Access:	Connect to the full text of this electronic book