Design and characterization of nanowire array as thermal interface material for electronics packaging /

Bibliographic Details

Main Author:	Chiang, Juei-Chun
Other Authors:	Hsieh, Sheng-Jen Tony (Thesis advisor)
Format:	Thesis eBook
Language:	English
Published:	[College Station, Tex.] : [Texas A&M University], [2010]
Subjects:	Major mechanical engineering. Nanowire thermal interface material electronics packaging
Online Access:	Link to OAK Trust copy