Handbook of 3D integration : technology and applications of 3D integrated circuits /

Bibliographic Details
Corporate Author:	Wiley InterScience (Online service)
Other Authors:	Bower, Christopher Andrew, Garrou, Philip E., Ramm, Peter
Format:	eBook
Language:	English
Published:	Weinheim : Wiley-VCH, 2008.
Subjects:	Integrated circuits > Design and construction. Integrated circuits. Semiconductor wafers. Three-dimensional imaging. Electronic books.
Online Access:	Connect to the full text of this electronic book

Available Online