Proceedings of the ASME InterPack Conference--2009 : presented at 2009 ASME InterPack Conference : July 19-23, 2009, San Francisco, California /

Bibliographic Details
Corporate Authors:	ASME/Pacific Rim Technical Conference and Exhibition on Integration and Packaging of MEMS, NEMS, and Electronic Systems San Francisco, CA, American Society of Mechanical Engineers. Electronic and Photonic Packaging Division
Other Authors:	Suhling, J. C. (Jeffrey C.), Ishizuka, Masaru, Tonapi, Sandeep
Format:	Conference Proceeding Book
Language:	English
Published:	New York, N.Y. : American Society of Mechanical Engineers, [2010]
Subjects:	Electronic packaging > Congresses.

Remote Storage