Bonding in microsystem technology /

Bibliographic Details
Main Author: Dziuban, J. A. (Jan A.)
Corporate Author: SpringerLink (Online service)
Format: eBook
Language:English
Published: [Dordrecht] : Springer, [2006]
Series:Springer series in advanced microelectronics. 24.
Subjects:
Online Access:Connect to the full text of this electronic book
Description
Item Description:Electronic resource.
Physical Description:xviii, 331 pages : 296 figures ; 25 cm.
Bibliography:Includes bibliographical references and index.
ISBN:1402045891
9781402045899
ISSN:1437-0387 ;
DOI:10.1007/1-4020-4589-1