Bonding in microsystem technology /
| Main Author: | |
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| Corporate Author: | |
| Format: | eBook |
| Language: | English |
| Published: |
[Dordrecht] :
Springer,
[2006]
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| Series: | Springer series in advanced microelectronics.
24. |
| Subjects: | |
| Online Access: | Connect to the full text of this electronic book |
| Item Description: | Electronic resource. |
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| Physical Description: | xviii, 331 pages : 296 figures ; 25 cm. |
| Bibliography: | Includes bibliographical references and index. |
| ISBN: | 1402045891 9781402045899 |
| ISSN: | 1437-0387 ; |
| DOI: | 10.1007/1-4020-4589-1 |