Bonding in microsystem technology /

Bibliographic Details
Main Author: Dziuban, J. A. (Jan A.)
Corporate Author: SpringerLink (Online service)
Format: eBook
Language:English
Published: [Dordrecht] : Springer, [2006]
Series:Springer series in advanced microelectronics. 24.
Subjects:
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Call Number: TK7874 .D95 2006eb
 
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TK7874 .D95 2006eb Available