SpringerLink (Online service), Lu, D., & Wong, C. P. (2008). Materials for advanced packaging. Springer. https://doi.org/10.1007/978-0-387-78219-5
Chicago Style (17th ed.) CitationSpringerLink (Online service), Daniel Lu, and C. P. Wong. Materials for Advanced Packaging. New York ; London: Springer, 2008. https://doi.org/10.1007/978-0-387-78219-5.
MLA (9th ed.) CitationSpringerLink (Online service), et al. Materials for Advanced Packaging. Springer, 2008. https://doi.org/10.1007/978-0-387-78219-5.
Warning: These citations may not always be 100% accurate.