Materials for advanced packaging /

Bibliographic Details
Corporate Author:	SpringerLink (Online service)
Other Authors:	Lu, Daniel, Wong, C. P., 1947-
Format:	eBook
Language:	English
Published:	New York ; London : Springer, 2008.
Subjects:	Microelectronic packaging. Packaging > Materials. Electronic books.
Online Access:	Connect to the full text of this electronic book

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