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Handbook of 3D integration : technology and applications of 3D integrated circuits /

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Bibliographic Details
Other Authors: Garrou, Philip E., Bower, Christopher Andrew, Ramm, Peter
Format: Book
Language:English
Published: Weinheim : Wiley-VCH, 2008.
Subjects:
Integrated circuits.
Integrated circuits > Design and construction.
Semiconductor wafers.
Three-dimensional imaging.

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Holdings details from Remote Storage
Call Number: TK7874 .H36 2005
Library Owns: TK7874 .H36 2005 (v.1-2)
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TK7874 .H36 2005 v.1 Available
TK7874 .H36 2005 v.2 Available