Reflow soldering processes : SMT, BGA, CSP and flip chip technologies /

Focused on technological innovations in the field of electronics packaging and production, this book elucidates the changes in reflow soldering processes, its impact on defect mechanisms, and, accordingly, the troubleshooting techniques during these processes in a variety of board types. Geared towa...

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Bibliographic Details

Main Author:	Lee, Ning-Cheng
Format:	eBook
Language:	English
Published:	Boston : Newnes, [2002]
Subjects:	Electronic apparatus and appliances > Design and construction. Solder and soldering. Electronic packaging. Electric connectors. Electronic books.
Online Access:	Connect to the full text of this electronic book Publisher description Table of contents