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Thermal conductance measurements of pressed OFHC copper contacts at liquid helium temperatures /

Bibliographic Details
Main Author:	Salerno, Louis J.
Corporate Author:	Ames Research Center
Other Authors:	Kittel, Peter, Spivak, Alan L.
Format:	Government Document Book
Language:	English
Published:	Moffet Field, Calif. : National Aeronautics and Space Administration, Ames Research Center, [1983]
Series:	NASA technical memorandum ; 85861.
Subjects:	Copper > Thermal conductivity. Liquid helium. Conductive heat transfer. Copper. Electric contacts. Low temperature physics. Surface roughness effects. Thermal resistance.
Online Access:	https://purl.fdlp.gov/GPO/LPS96095

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