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Thermal conductance measurements of pressed OFHC copper contacts at liquid helium temperatures /

Bibliographic Details
Main Author: Salerno, Louis J.
Corporate Author: Ames Research Center
Other Authors: Kittel, Peter, Spivak, Alan L.
Format: Government Document Book
Language:English
Published: Moffet Field, Calif. : National Aeronautics and Space Administration, Ames Research Center, [1983]
Series:NASA technical memorandum ; 85861.
Subjects:
Copper > Thermal conductivity.
Liquid helium.
Conductive heat transfer.
Copper.
Electric contacts.
Low temperature physics.
Surface roughness effects.
Thermal resistance.
Online Access:https://purl.fdlp.gov/GPO/LPS96095

Internet

https://purl.fdlp.gov/GPO/LPS96095

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Call Number: NAS 1.15:85861
 
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Holdings details from Evans: US Documents Microfiche (3rd floor)
Call Number: NAS 1.15:85861
 
Call Number Status Get It
NAS 1.15:85861 Available