Thermal conductance measurements of pressed OFHC copper contacts at liquid helium temperatures /

Bibliographic Details
Main Author: Salerno, Louis J.
Corporate Author: Ames Research Center
Other Authors: Kittel, Peter, Spivak, Alan L.
Format: Government Document Book
Language:English
Published: Moffet Field, Calif. : National Aeronautics and Space Administration, Ames Research Center, [1983]
Series:NASA technical memorandum ; 85861.
Subjects:
Online Access:https://purl.fdlp.gov/GPO/LPS96095

MARC

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100 1 |a Salerno, Louis J. 
245 1 0 |a Thermal conductance measurements of pressed OFHC copper contacts at liquid helium temperatures /  |c Louis J. Salerno, P. Kittel, and A. L. Spivak. 
264 1 |a Moffet Field, Calif. :  |b National Aeronautics and Space Administration, Ames Research Center,  |c [1983] 
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490 1 |a NASA technical memorandum ;  |v 85861 
530 |a Also available via Internet from the NTRS web site. Address as of 07/01/08: http://ntrs.nasa.gov/archive/nasa/casi.ntrs.nasa.gov/19840004741%5F1984004741.pdf ; current access is available via PURL. 
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500 |a Microform. 
650 0 |a Copper  |x Thermal conductivity. 
650 0 |a Liquid helium. 
650 7 |a Conductive heat transfer.  |2 nasat 
650 7 |a Copper.  |2 nasat 
650 7 |a Electric contacts.  |2 nasat 
650 7 |a Low temperature physics.  |2 nasat 
650 7 |a Surface roughness effects.  |2 nasat 
650 7 |a Thermal resistance.  |2 nasat 
700 1 |a Kittel, Peter. 
700 1 |a Spivak, Alan L. 
710 2 |a Ames Research Center. 
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