Thermal conductance measurements of pressed OFHC copper contacts at liquid helium temperatures /

Bibliographic Details
Main Author:	Salerno, Louis J.
Corporate Author:	Ames Research Center
Other Authors:	Kittel, Peter, Spivak, Alan L.
Format:	Government Document Book
Language:	English
Published:	Moffet Field, Calif. : National Aeronautics and Space Administration, Ames Research Center, [1983]
Series:	NASA technical memorandum ; 85861.
Subjects:	Copper > Thermal conductivity. Liquid helium. Conductive heat transfer. Copper. Electric contacts. Low temperature physics. Surface roughness effects. Thermal resistance.
Online Access:	https://purl.fdlp.gov/GPO/LPS96095

Description
Item Description:	Microform.
Physical Description:	1 volume Also available via Internet from the NTRS web site. Address as of 07/01/08: http://ntrs.nasa.gov/archive/nasa/casi.ntrs.nasa.gov/19840004741%5F1984004741.pdf ; current access is available via PURL.