Cover Image

Reliability, packaging, testing, and characterization of MEMS/MOEMS VII : 21-22 January 2008, San Jose, California, USA /

Bibliographic Details
Corporate Authors: Society of Photo-optical Instrumentation Engineers, Boston University. Photonics Center
Other Authors: Hartzell, Allyson L., Ramesham, Rajeshuni
Format: Book
Language:English
Published: Bellingham, Washington : SPIE, [2008]
Series:Proceedings of SPIE--the International Society for Optical Engineering ; v. 6884.
Subjects:
Microelectromechanical systems > Reliability > Congresses.
Microelectromechanical systems > Testing > Congresses.
Microelectronic packaging > Congresses.
Online Access:https://www.spiedigitallibrary.org/conference-proceedings-of-SPIE/6884.toc
Description
Item Description:Some previous conferences entitled: Reliability, testing, and characterization of MEMS/MOEMS
Physical Description:1 volume (various pagings) : illustrations ; 28 cm.
Bibliography:Includes bibliographical references and index.
ISBN:9780819470591
0819470597