Cover Image

Electronic and photonics packaging : Multi-Scale Electrical and Mechanical Systems--2006 presented at 2006 ASME International Mechanical Engineering Congress and Exposition : November 5-10, 2006, Chicago, Illinois, USA /

Bibliographic Details
Corporate Authors: American Society of Mechanical Engineers. Electronic and Photonic Packaging Division, International Mechanical Engineering Congress and Exposition
Format: Conference Proceeding Book
Language:English
Published: New York, N.Y. : ASME, [2007]
Series:EPP (Series) ; v. 6.
Subjects:
Electronic packaging > Congresses.
Photonics > Congresses.
Nanotechnology > Congresses.
Microelectronic packaging > Congresses.
Surface mount technology > Congresses.
Microelectromechanical systems > Congresses.
Integrated circuits > Wafer-scale integration > Congresses.
Description
Item Description:"Quality and reliability of electronic/photonics packaging, MEMS/NEMS packaging, MEMS/NEMS novel materials and structures, Ecoelectronics."
Physical Description:xix, 526 pages : illustrations ; 28 cm.
Bibliography:Includes bibliographical references and author index.
ISBN:0791847691
9780791847695