Electronic and photonics packaging : Multi-Scale Electrical and Mechanical Systems--2006 presented at 2006 ASME International Mechanical Engineering Congress and Exposition : November 5-10, 2006, Chicago, Illinois, USA /

Bibliographic Details
Corporate Authors:	American Society of Mechanical Engineers. Electronic and Photonic Packaging Division, International Mechanical Engineering Congress and Exposition
Format:	Conference Proceeding Book
Language:	English
Published:	New York, N.Y. : ASME, [2007]
Series:	EPP (Series) ; v. 6.
Subjects:	Electronic packaging > Congresses. Photonics > Congresses. Nanotechnology > Congresses. Microelectronic packaging > Congresses. Surface mount technology > Congresses. Microelectromechanical systems > Congresses. Integrated circuits > Wafer-scale integration > Congresses.

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