Reliability, packaging, testing, and characterization of MEMS/MOEMS VI : 23-24 January 2007, San Jose, California, USA /

Bibliographic Details
Corporate Author:	Society of Photo-optical Instrumentation Engineers
Other Authors:	Hartzell, Allyson L., Ramesham, Rajeshuni
Format:	Book
Language:	English
Published:	Bellingham, Washington : SPIE, [2007]
Series:	Proceedings of SPIE--the International Society for Optical Engineering ; v. 6463.
Subjects:	Microelectromechanical systems > Reliability > Congresses. Microelectromechanical systems > Testing > Congresses. Microelectronic packaging > Congresses.

Remote Storage