Materials, technology and reliability of low-k dielectrics and copper interconnects : symposium held April 18-21, 2006, San Francisco, California, U.S.A. /

Bibliographic Details
Corporate Authors:	Symposium F, "Materials, Technology and Reliability of Low-K Dielectrics and Copper Interconnects" San Francisco, Calif., Materials Research Society. Fall Meeting
Other Authors:	Tsui, Ting Y. (Ting Yiu)
Format:	Conference Proceeding Book
Language:	English
Published:	Warrendale, Pa. : Materials Research Society, [2006]
Series:	Materials Research Society symposia proceedings ; v. 914.
Subjects:	Semiconductors > Materials > Congresses. Semiconductors > Junctions > Congresses. Dielectric films > Congresses. Integrated circuits > Materials > Congresses. Integrated circuits > Reliability > Congresses.

Remote Storage