Cover Image

Photonics packaging and integration VI : 25-26 January 2006, San Jose, California, USA /

Bibliographic Details
Corporate Author: Society of Photo-optical Instrumentation Engineers
Other Authors: Earman, Allen M., Chen, Ray T.
Format: Book
Language:English
Published: Bellingham, Washington : SPIE, [2006]
Series:Proceedings of SPIE--the International Society for Optical Engineering ; v. 6126.
Subjects:
Optoelectronic devices > Design and construction > Congresses.
Optical interconnects > Congresses.
Microelectronic packaging > Congresses.
Photonics > Congresses.
Description
Item Description:Some earlier conferences were part of a larger conference entitled: Optoelectronic interconnects. Photonics packaging and integration.
Physical Description:1 volume (various pagings) : illustrations ; 28 cm.
Bibliography:Includes bibliographical references and index.
ISBN:0819461687