Photonics packaging and integration VI : 25-26 January 2006, San Jose, California, USA /

Bibliographic Details
Corporate Author:	Society of Photo-optical Instrumentation Engineers
Other Authors:	Earman, Allen M., Chen, Ray T.
Format:	Book
Language:	English
Published:	Bellingham, Washington : SPIE, [2006]
Series:	Proceedings of SPIE--the International Society for Optical Engineering ; v. 6126.
Subjects:	Optoelectronic devices > Design and construction > Congresses. Optical interconnects > Congresses. Microelectronic packaging > Congresses. Photonics > Congresses.

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