High temperature fatigue behavior of tungsten copper composites /

Bibliographic Details
Main Author:	Verrilli, Michael J.
Corporate Author:	United States. National Aeronautics and Space Administration
Other Authors:	Kim, Yonk-Suk, Gabb, Timothy Paul, 1958-
Format:	Government Document Microform Book
Language:	English
Published:	[Washington, D.C.] : NASA ; [1990]
Series:	NASA technical memorandum ; 102404.
Subjects:	Metallic composites > Thermal fatigue. Copper alloys. Fiber composites. High temperature. Metal fibers. Metal matrix composites. Thermal fatigue. Thermodynamics. Tungsten alloys.
Online Access:	https://purl.fdlp.gov/GPO/LPS66893

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