Electronic and photonic packaging, Integration and packaging of micro/nano/electronic systems--2005 : presented at 2005 ASME International Mechanical Engineering Congress and Exposition : November 5-11, 2005, Orlando, Florida, USA /

Bibliographic Details
Corporate Authors:	American Society of Mechanical Engineers. Electronic and Photonic Packaging Division, International Mechanical Engineering Congress and Exposition
Format:	Conference Proceeding Book
Language:	English
Published:	New York, N.Y. : ASME, [2005]
Series:	EPP (Series) ; v. 5.
Subjects:	Electronic packaging > Congresses. Photonics > Congresses. Nanotechnology > Congresses. Microelectronic packaging > Congresses. Surface mount technology > Congresses. Microelectromechanical systems > Congresses. Integrated circuits > Wafer-scale integration > Congresses.

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