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Lead-free solder interconnect reliability /

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Bibliographic Details
Other Authors: Shangguan, Dongkai, 1963-
Format: Book
Language:English
Published: Materials Park, OH : ASM International, 2005.
Subjects:
Microelectronic packaging > Reliability.
Solder and soldering.
Lead-free electronics manufacturing processes.

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Call Number: TK7870.15 .L425 2005
 
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TK7870.15 .L425 2005 Available