Materials, technology and reliability for advanced interconnects--2005 : symposium held March 28-April 1, 2005, San Francisco, California, U.S.A /

Bibliographic Details
Corporate Authors:	Materials Research Society. Fall Meeting, Symposim on Materials, Technology and Reliability for Advanced Interconnects
Other Authors:	Besser, Paul R.
Format:	Conference Proceeding Book
Language:	English
Published:	Warrendale, Pa. : Materials Research Society, [2005]
Series:	Materials Research Society symposia proceedings ; v. 863.
Subjects:	Semiconductors > Materials > Congresses. Semiconductors > Junctions > Congresses. Dielectric films > Congresses. Integrated circuits > Materials > Congresses. Integrated circuits > Reliability > Congresses.

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