Cover Image

Area array packaging processes : for BGA, Flip Chip, and CSP /

Bibliographic Details
Other Authors: Gilleo, Ken
Format: Book
Language:English
Published: New York : McGraw-Hill, [2004]
Subjects:
Microelectronic packaging.
Multichip modules (Microelectronics)
Online Access:Table of contents
Publisher description
Contributor biographical information
Description
Physical Description:x, 260 pages : illustrations ; 25 cm.
Bibliography:Includes bibliographical references and index.
ISBN:0071428291 (acid-free paper)
9780071428293 (acid-free paper)