Area array packaging processes : for BGA, Flip Chip, and CSP /

Bibliographic Details
Other Authors:	Gilleo, Ken
Format:	Book
Language:	English
Published:	New York : McGraw-Hill, [2004]
Subjects:	Microelectronic packaging. Multichip modules (Microelectronics)
Online Access:	Table of contents Publisher description Contributor biographical information

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