Vedantham, V., & Suh, C. S. (2003). In-situ temperature and thickness characterization for silicon wafers undergoing thermal annealing. [Texas A&M University].
Chicago Style (17th ed.) CitationVedantham, Vikram, and Chii-Der S. Suh. In-situ Temperature and Thickness Characterization for Silicon Wafers Undergoing Thermal Annealing. [College Station, Tex.]: [Texas A&M University], 2003.
MLA (9th ed.) CitationVedantham, Vikram, and Chii-Der S. Suh. In-situ Temperature and Thickness Characterization for Silicon Wafers Undergoing Thermal Annealing. [Texas A&M University], 2003.
Warning: These citations may not always be 100% accurate.