In-situ temperature and thickness characterization for silicon wafers undergoing thermal annealing /

Bibliographic Details
Main Author:	Vedantham, Vikram, 1979-
Other Authors:	Suh, Chii-Der S. (Thesis advisor)
Format:	Thesis eBook
Language:	English
Published:	[College Station, Tex.] : [Texas A&M University], [2003]
Subjects:	Major mechanical engineering. Ultrasonics Wave Propagation Silicon Wafers RTP Thermal Processing wafer Thermal Annealing Lamb waves Signal Processing Gabor Wavelet Transform Wavelet Transform Group Velocity Semiconductor
Online Access:	Link to OAK Trust copy

Link to OAK Trust copy

Available Online