Materials, integration and packaging issues for high-frequency devices : symposium held December 1-3, 2003, Boston, Massachusetts, U.S.A. /
| Corporate Authors: | , , |
|---|---|
| Other Authors: | |
| Format: | Conference Proceeding Book |
| Language: | English |
| Published: |
Warrendale, Pa. :
Materials Research Society,
[2004]
|
| Series: | Materials Research Society symposia proceedings ;
v. 783. |
| Subjects: |
| Item Description: | "This volume is a collection of half of the papers given at Symposium B, the first MRS symposium on 'Materials, Integration and Packaging Issues for High-Frequency devices, ' held December 1-3 at the 2003 MRS Fall Meeting in Boston, Massachusetts ..."--P. xi. |
|---|---|
| Physical Description: | xiii, 232 pages : illustrations ; 24 cm. |
| Bibliography: | Includes bibliographical references and indexes. |
| ISBN: | 1558997210 |