Materials, integration and packaging issues for high-frequency devices : symposium held December 1-3, 2003, Boston, Massachusetts, U.S.A. /

Bibliographic Details
Corporate Authors:	Materials Research Society, Materials Research Society. Fall Meeting, Symposium on Materials, Integration and Packaging Issues for High-Frequency Devices
Other Authors:	Muralt, P.
Format:	Conference Proceeding Book
Language:	English
Published:	Warrendale, Pa. : Materials Research Society, [2004]
Series:	Materials Research Society symposia proceedings ; v. 783.
Subjects:	Electronic packaging > Materials > Congresses.

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