Cover Image

Photonics packaging and integration IV : 29 January 2003, San Jose, California, USA /

Bibliographic Details
Corporate Author: Society of Photo-optical Instrumentation Engineers
Other Authors: Heyler, Randy A., Chen, Ray T.
Format: Book
Language:English
Published: Bellingham, Washington : SPIE, [2004]
Series:Proceedings of SPIE--the International Society for Optical Engineering ; v. 5358.
Subjects:
Microelectronic packaging > Congresses.
Photonics > Congresses.
Optoelectronic devices > Design and construction > Congresses.
Optical interconnects > Congresses.
Description
Item Description:Earlier conferences were part of a larger conference entitled: Optoelectronic interconnects. Photonics packaging and integration
Physical Description:vii, 168 pages : illustrations ; 28 cm.
Bibliography:Includes bibliographical references and index.
ISBN:0819452661