Photonics packaging and integration IV : 29 January 2003, San Jose, California, USA /

Bibliographic Details
Corporate Author:	Society of Photo-optical Instrumentation Engineers
Other Authors:	Heyler, Randy A., Chen, Ray T.
Format:	Book
Language:	English
Published:	Bellingham, Washington : SPIE, [2004]
Series:	Proceedings of SPIE--the International Society for Optical Engineering ; v. 5358.
Subjects:	Microelectronic packaging > Congresses. Photonics > Congresses. Optoelectronic devices > Design and construction > Congresses. Optical interconnects > Congresses.

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