Electronic and photonic packaging, electrical systems and photonic design, and nanotechnology--2003 : presented at the 2003 ASME International Mechanical Engineering Congress : November 15-21, 2003, Washington, D.C. /

Bibliographic Details
Corporate Authors:	American Society of Mechanical Engineers. Electronic and Photonic Packaging Division, International Mechanical Engineering Congress and Exposition
Other Authors:	Lee, S. W. Ricky
Format:	Conference Proceeding Book
Language:	English
Published:	New York, N.Y. : American Society of Mechanical Engineers, [2003]
Series:	EPP (Series) ; v. 3.
Subjects:	Electronic packaging > Congresses. Photonics > Congresses. Nanotechnology > Congresses. Microelectronic packaging > Congresses. Surface mount technology > Congresses. Microelectromechanical systems > Congresses. Integrated circuits > Wafer-scale integration > Congresses.

Remote Storage