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Advances in electronic packaging, 2003 : presented at 2003 International Electronic Packaging Technical Conference and Exhibition : July 6-11, 2003, Maui, Hawaii /

Bibliographic Details
Corporate Authors: American Society of Mechanical Engineers. Electronic and Photonic Packaging Division, International Electronic Packaging Technical Conference and Exhibition
Format: Conference Proceeding Book
Language:English
Published: New York, N.Y. : American Society of Mechanical Engineers, [2003]
Subjects:
Electronic packaging > Congresses.

Remote Storage

Holdings details from Remote Storage
Call Number: TK7870.15 .A83 2003
Library Owns: TK7870.15 .A83 2003 (v.1-2)
Call Number Status Get It
TK7870.15 .A83 2003 v.1 Available
TK7870.15 .A83 2003 v.2 Available