A study of plasma modification of low k polyimide thin film /

To meet the next generation device performance demands, high-speed integrated circuits are required. By just shrinking the device size, the desired device performance cannot be achieved. Thus, to improve the performance sufficiently, new substitute materials for current metal and interlayer dielectr...

Full description

Bibliographic Details

Main Author:	Chung, Taewoo
Format:	Thesis eBook
Language:	English
Published:	[Place of publication not identified] : [publisher not identified] ; 2002.
Subjects:	Major chemical engineering.
Online Access:	Link to OAKTrust copy