Fracture and strength of solids : proceedings of the Third International Conference on Fracture and Strength of Solids : Hong Kong, December 8-10, 1997 /

Bibliographic Details
Corporate Author:	International Conference on Fracture and Strength of Solids Hong Kong, China
Other Authors:	Tong, Pin, Zhang, T. Y., Kim, Chae-gwang
Format:	Conference Proceeding Book
Language:	English
Published:	Uetikon-Zuerich, Switzerland ; Enfield, N.H. : Trans Tech Publications, [1998]
Series:	Key engineering materials. v. 145-149.
Subjects:	Strength of materials > Congresses. Fracture mechanics > Congresses.

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