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Electronic and photonic packaging, electrical systems and photonic design, and nanotechnology : presented at the 2002 ASME International Mechanical Engineering Congress and Exposition, November 17-22, 2002, New Orleans, Louisiana /

Bibliographic Details
Corporate Authors: American Society of Mechanical Engineers. Electronic and Photonic Packaging Division, International Mechanical Engineering Congress and Exposition
Format: Conference Proceeding Book
Language:English
Published: New York : American Society of Mechanical Engineers, [2002]
Series:EPP (Series) ; v. 2.
Subjects:
Electronic packaging > Congresses.
Photonics > Congresses.
Nanotechnology > Congresses.
Microelectronic packaging > Congresses.
Surface mount technology > Congresses.
Microelectromechanical systems > Congresses.
Integrated circuits > Wafer-scale integration > Congresses.
Description
Physical Description:xiii, 572 pages : illustrations ; 28 cm.
Bibliography:Includes bibliographical references and index.
ISBN:0791836487
9780791836484