Electronic and photonic packaging, electrical systems and photonic design, and nanotechnology : presented at the 2002 ASME International Mechanical Engineering Congress and Exposition, November 17-22, 2002, New Orleans, Louisiana /

Bibliographic Details
Corporate Authors:	American Society of Mechanical Engineers. Electronic and Photonic Packaging Division, International Mechanical Engineering Congress and Exposition
Format:	Conference Proceeding Book
Language:	English
Published:	New York : American Society of Mechanical Engineers, [2002]
Series:	EPP (Series) ; v. 2.
Subjects:	Electronic packaging > Congresses. Photonics > Congresses. Nanotechnology > Congresses. Microelectronic packaging > Congresses. Surface mount technology > Congresses. Microelectromechanical systems > Congresses. Integrated circuits > Wafer-scale integration > Congresses.

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