Microvias : for low cost, high density interconnects /

Bibliographic Details
Main Author:	Lau, John H.
Corporate Author:	NetLibrary, Inc
Other Authors:	Lee, S. W. Ricky
Format:	eBook
Language:	English
Published:	New York : McGraw-Hill, 2001.
Subjects:	Microelectronic packaging. Integrated circuits > Design and construction > Cost control. Semiconductors > Junctions. Printed circuits. Electronic books.
Online Access:	Connect to the full text of this electronic book

Available Online