Fatigue life prediction of solder joints in electronic packages with ANSYS /
| Main Author: | |
|---|---|
| Other Authors: | , |
| Format: | Book |
| Language: | English |
| Published: |
Boston :
Kluwer Academic Publishers,
[2003]
|
| Series: | Kluwer international series in engineering and computer science ;
SECS 719. |
| Subjects: |
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